IC器件热特性评价方法研究.pdfVIP

电 子机 械 工程 2008年第24卷第1期 18 Electro—Mechanical Engineering 2008．Vo1．24 No．1 IC器件热特性评价方法研究 周德俭 。黄红艳 ，彭开强 (1．广西工学院，广西柳州545006；2．桂林电子科技大学，广西桂林541004) 摘 要：在IC器件的热设计中，传统的单参数变化热分析评价方法忽略了各个参数的相互影响和共同 作用，没有进行多参数综合优化设计，难以适应高密度Ic器件结构多参数相互影响和共同作用、热可靠 性要求高的实际情况与设计要求。文中以QFP器件为例，研究将正交实验法与表面响应法结合的分析 方法应用于Ic器件的热特性分析评价。该方法能综合考虑各设计参数对Ic器件封装热性能的共同作 用，从而实现多参数综合优化热设计，是一种较理想实用的IC器件热特性评价和热设计方法。 关键词：热分析；正交实验法；表面响应法；IC器件 中图分类号：TN305．94 文献标识码：A 文章编号：1008—5300(2008)01—0018—05 Study on Evaluation Method for the Heat Characteristics of IC Devices ZHOU De—jian ’ ．HUANG Hong—yan ．PENG Kai—qiang (1．Guangxi University ofTechnology，Li~hou 545006，China) (2．Guilin University of Electronic Technology， Guilin 54 1004，China) Abstract：In the thermal design of IC(integrated circuit)devices，the traditional single varying parameter ap— praisal method for thermal analysis has ignored the mutual influence and interaction between parameters． Without a multi—parameter synthetical design and optimization，now it does not meet the reality and design de— mand any longer that high density IC device works with the multi—parameter influence and interaction and high heat reliability．In this paper，the analysis method of the combination of the orthogonal experimental method and response surface method is applied to the analysis and evaluation for IC device heat characteristic with QFP(quad flat package)device as an example．This one can take it into account thoroughly that some design parameters work commonly on the package heat performance of the IC device，and bring the multi—parameter and synthetical optimization heat design into reality sequentially．So it is a perfect and applied method for the he