微量锗对Sn-0.7Cu-0.05Ni钎料微观组织和性能的影响.pdfVIP

微量锗对Sn-0.7Cu-0.05Ni 钎料微观组织与性能的影响 易江龙，张宇鹏，许 磊，刘师田，杨永强 （广州有色金属研究院 焊接技术研究所，广东 广州 510651） 摘要: 通过向Sn-0.7Cu-0.05Ni 无铅钎料中添加微量锗，研究了不同锗含量（0.01~0.10wt%）对SnCuNi 钎料合 金显微组织及性能的影响。结果表明，微量的锗能显著细化 Sn-0.7Cu-0.05Ni 钎料合金组织，抑制金属间化合物的 生长，改善合金的组织分布，提高钎料的润湿性及力学性能。此外，锗的添加还能显著提高钎料的抗氧化性，当添 加量为0.1%时还能降低钎料的溶铜速率。 关键词:Sn-Cu-Ni ；无铅钎料；锗；溶铜性；抗氧化性； 中图分类号: TG425 文献标识码:A 文章编号: Effect of adding Ge on microstructure and properties of Sn-0.7Cu-0.05Ni Solder Alloy YI Jianglong, ZHANG Yupeng, XU Lei, LIU Shitian, YANG Yongqiang (Guangzhou Research Institute of Non-ferrous Metals, Guangzhou , 510651, China) Abstract: In order to explore the influence of Ge on the Sn-0.7Cu-0.05Ni solder alloy, various small amounts of germanium (0.01~0.10wt%) were added into this alloy and their properties were investigated. The results show that adding trace amount of germanium could refine the grain size of the Sn -0.7Cu-0.05Ni solder alloy and inhibit the growth of intermetallic compound. Meanwhile, more uniform microstructure and improvements of the wettability and mechanical properties were obtained with germanium addition. Moreover, the addition of germanium could reduce the oxidation rate, and the copper dissolution also reduced while the addition amount of germanium is reached to 0.10%. Key words : Sn-Cu-Ni ；Lead-free solder ；germanium；Copper dissolution ；Oxidation rate [5] 随着电子产业绿色制造的不断发展，无铅钎料 来改善其综合性能 ，如微量Ni 的加入可抑制焊盘 已逐步取代传统的 Sn-37Pb 钎料在电子组装上的应 铜向钎料中溶解，改善钎料的流动性，抑制波峰焊