Enhanced effect of diffused Ohmic contact metal atoms for device scaling in AlGaNGaN heterostructure field-effect transistors.pdfVIP
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Enhanced effect of diffused Ohmic contact metal atoms for device scaling in AlGaNGaN heterostructure field-effect transistors.pdf
Superlattices and Microstructures 103 (2017) 113e120
Contents lists available at ScienceDirect
Superlattices and Microstructures
journal homepage: /locate/superlattices
Enhanced effect of diffused Ohmic contact metal atoms for
device scaling in AlGaN/GaN heterostructure ?eld-effect transistors
Huan Liu a, Aijie Cheng a, *, Zhaojun Lin b, Peng Cui b, Yan Liu b, Chen Fu b, Yuanjie Lv c, Zhihong Feng c, Chongbiao Luan d
a School of Mathematics, Shandong University, Jinan, 250100, China b School of Microelectronics, Shandong University, Jinan, 250100, China c National Key Laboratory of Application Speci?c Integrated Circuit (ASIC), Hebei Semiconductor Research Institute, Shijiazhuang, 050051, China d Key Laboratory of Pulsed Power, Institute of Fluid Physics, CAEP, Mianyang, 621999, China
article info
Article history: Received 9 January 2017 Accepted 18 January 2017 Available online 20 January 2017
Keywords: AlGaN/GaN HFETs Diffused Ohmic contact metal atoms Polarization Coulomb ?eld scattering
abstract
Using measured capacitance-voltage and current-voltage curves for the AlGaN/GaN heterostructure ?eld-effect transistors with different source-drain spacing, the electron mobility under the gate region was obtained. By comparing mobility variation and analyzing polarization charge distribution, it is found that with device scaling, the effect of the diffused Ohmic contact metal atoms on the electron mobility is enhanced. Then, a theoretical calculation related to different scattering mechanisms was adopted and it was veri?ed this enhanced effect is due to the enhanced polarization Coulomb ?eld (PCF) scattering.
? 2017 Elsevier Ltd. All rights reserved.
1. Introduction
Ohmic contacts are critical to the realization of high-frequency application in AlGaN/GaN heterostructure ?eld effect transistors (HFETs) [1,2]. The normal Ohmic contact processes include multilayer metal deposition and rapidly thermal annealing. During thermal annealing, huge Ohmic contact metal atoms inevi
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