激光键合技术在封装中的应用及研究进展 application and research progress of laser bonding technology in packaging.pdfVIP

电子 工 业 专 用 设 备 封装工艺技术 Eguipment for Electronic Products Manufacturing 激光键合技术在封装 中的 应用及研究进展 田艳红，王春青 ，孔令超 哈尔滨工业大学现代焊接生产技术国家重点实验室微连接研究室 黑龙江 哈尔滨 ! 150001# ! ! ! 摘 要 激光键合技术以其局部非接触加热 灵活性强和可控性能好的优点在电子封装 光电子封 # 装以及MEMS 封装中得到了应用 以几种激光键合技术的研究和应用为实例 分析和探讨了激光 键合技术中的关键问题及其发展趋势 ! $ $ $ 关键词 激光键合技术 电子封装 光电子封装 MEMS 封装 中图分类号! 文献标识码! 文章编号! TG456.7 A 1004-4507 （2007）05-0022-07 Application and Research Progress of Laser Bonding Technology in Packaging TIAN Yan-hong, WANG Chun-ging, KONG Ling-chao (Microj oing Lab, State Key Lab of Advanced Welding production Technology, Harbin Institute of Technology, Harbin 15000 1, China) Abstract ! Laser bonding technelogy, Which offters the advantages of non-contact, local heating and flexibility, has attracted more attention in electronic, optoelectronic and MEMS packaging. In this pa- per, several case studies on laser bonding technologies Were presented, and maj or problems in research and applications as Well as the trend of laser bonding technology Were analysed and discussed. Keywords:Laser bonding technology; Electronic packaging; Optoelectronic packaging; MEMS packaging 1 引 言 (MEMS-Micro Electro-Mechanical System) 、光 电子 、 微传感器等器件