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Substrate Mapping in Inkless Assembly Dave Huntley KINESYS Software Phone: +1 (707) 766 8855 Web site: th 10 Annual International KGD Packaging and Test Workshop Sept. 8-10, 2003 Napa, CA Introduction • Standards – Existing and planned standards • Inkless Assembly Process – Some examples of process steps in an inkless assembly line that might use substrate mapping – Device Tracking – Marking devices with a unique code – Tracking the devices from substrate to substrate – Relating maps to complex assemblies (e.g. stacked devices) th 10 Annual International KGD Packaging and Test Workshop Sept. 8-10, 2003 Napa, CA Definitions from SEMI G81 • Substrate - Any carrier of a two- dimensional array of devices, including but no limited to wafer, tray, strip or tape. • Device – the unit to which the device status code in the map is assigned including but not limited to: die, multi- chip modules and packages. • Map – A two dimensional array of bin codes (derived from electrical test data) of a substrate. th 10 Annual International KGD Packaging and Test Workshop Sept. 8-10, 2003 Napa, CA Other Terms Used • Wafer – e.g. wafer, wafer mounted on a film frame • Strip –e.g. lead frame or solid BGA strip • Tray – e.g. waffle pack or JEDEC tray th 10 Annual International KGD Packaging and Test Workshop Sept. 8-10, 2003 Napa, CA Standards – Existing • SEMI G81 – Map Data Items • SEMI G84 – Strip Map Protocol • SEMI G85 – Map Data Format th 10 Annual International KGD Packaging and Test Workshop Sept. 8-10, 2003 Napa, CA Standards – In Development • SEMI G81.1 – Map Da