雷射製程簡介.pptVIP

? THIN CORE ? A thin laminate material (usually under .025” thick) consisting of a glass epoxy Substrate clad with copper on both sides. ? The size of the core is larger than the finished size of the Board. ? Dry Film Resist Coat ? A light sensitive film is applied by heat and pressure to the copper surfaces of the core. Raw Material:FR-4 Sheet size : 36”*48” , 40”*48” ,42”*48 Core Thickness : 0.003”,0.004”,0.005”,0.006” 0.008”,0.010”,0.012”,0.015” 0.021”,0.031”,0.039”,0.047” Copper Foil: 1/3 oz,1/2 oz,1.0 oz,2 oz ? THIN CORE ? A thin laminate material (usually under .025” thick) consisting of a glass epoxy Substrate clad with copper on both sides. ? The size of the core is larger than the finished size of the Board. ? Dry Film Resist Coat ? A light sensitive film is applied by heat and pressure to the copper surfaces of the core. UNIMICRON Laser Manufacturing Processing 雷射製程簡介 雷射製程簡介 甚麼是HDI? HDI : High Density Interconnection The IPC defines HDI printed circuit board as organic substrates with vias of 6 mils(150 um) or less in diameter, made by any number of processes(laser, photo, plasma, mechanical…..) 雷射製程簡介 HDI之技術特點 1). 具非機械鑽孔之微導孔(micro-via) 2.) 孔徑在6 mil以下 3.) 孔環(A/R) 10 mil 以下 4.) 接點密度大於 130點/IN2 5.) 佈線密度大於117/IN2 6.) Line/Space 不大於 3 mil/ 3mil. 雷射製程簡介 HDI與傳統PCB之區別 成孔方式之差異 HDI之微導孔為非機械鑽孔,主要方式有: Laser Photo Plasma… 雷射製程簡介 孔的幾種主要形式 你知道嗎? C B A C LASER BLIND BURIED VIA LAY-UP A = THROUGH VIA HOLE (導通孔) B = BURIED VIA HOLE (埋孔) C = Laser Blind Via (雷射盲孔 ) 雷射製程簡介 雷射光的種類 雷射光 紫外光 紅外光 YAG Laser Excimer Laser RF CO2 Laser TEA CO2 Laser (冷加工) (熱加工) 雷射燒蝕原理 雷射製程簡介 利用有機板材對雷射光能量的吸收,將板材燒成氣體逸走或將其樹脂的高分子長鏈打斷予以移除而成孔. 光熱性燒蝕 光化性裂蝕 CO2雷射搚帶熱能量 波長500~10600nm紅外光將有機板材以強熱熔化或汽化使之成孔。 UV雷射搚帶化學能 波長＜400nm紫外光，以其具有之高能量之光子，將有機物高分子長鍵打斷，粉粒塵推擠跳離板材成孔。 雷射製程簡介 Hole shape by top hat beam Hole shape by g