CCP508S 技术资料-950601.pdfVIP

To ： CUSTOMER Date: June.01, 2006 CCP-508S 銅箔積層板 ～耐漏電絕緣型 COPPER CLAD LAMINATE ～ ANTI-TRACKING TYPE 長春人造樹脂廠股份有限公司 CHANG CHUN PLASTICS CO., LTD. CCP-508S CCP-508S 玻纖布環氧樹脂覆銅箔積層板是針對使用高密度自動插件、晶片零件表面粘著 技術等之精密印刷電路板而開發。 在高電壓大電流下具有優異的耐電弧發火性，能改善 電子產品的安全性。 並且可適用於常溫沖孔加工作業。 CCP-508S, anti-tracking characteristic material, is a newly developed woven glass cloth and kraft paper based epoxy resin copper clad laminate. It responds to the requirement of high precision printed circuit board made by high density automatic insertion, surface mounting of chip parts, etc. It is excellent in resisting arc sparking due to high voltage and large current, thereby improving safety of electronic devices. It is also suitable for ambient temperature punching process. 品名 CCP-508S Type ANSI (NEMA) CEM-1 規格 UL 94V-0 Grade Raw material of CCP-508S is CCP-508U and CCP508Us CTI grade is 600V over 組成 玻纖布、漂白牛皮紙、環氧樹脂、高純度電解銅箔。 Construction Woven Glass Cloth, Kraft Paper, Epoxy Resin, high purity of Electrolytic Copper Foil. *耐漏電絕緣性, 高電壓大電流下耐電弧發火性良好。 具有優良的耐漏電絕緣性與耐高壓發火性，適用於高電壓之用途。 *High tracking performance and excellent in resisting arc sparking due to high voltage and large current. Suitable for high tension service owing to high tracking performance and excellent high-tension sparking resistance. *常溫沖孔性良好 最適當之沖孔溫度為30~60℃。 高密度沖孔加工性優良，能改善沖孔後外觀與 特性 Characteristics 尺寸精度。 *Good punchability at ambient temperature Optimum punching temperature is 30~60℃