集成电路封装发展.doc.docVIP

集成电路封装发展 摘要：集成电路封装是指利用膜技术及细微加工技术，将芯片及其他要素在框架或基板上布局、粘贴固定及连接，引出接线端子并通过可塑性绝缘介质灌注固定构成整体立体结构的工艺。它不仅起着安装、固定、密封、保护芯片及增强电热性能等方面的作用，而且还通过芯片上的接点用导线连接到封装外壳的引脚上，这些引脚又通过印刷电路板上的导线与其他器件相连接，从而实现内部芯片与外部电路的连接。集成电路封装是伴随集成电路的发展而前进的。随着集成电路及封装技术的不断发展，整机也向着多功能、小型化方向发展。这样，就要求集成电路的集成度越来越高，功能越来越复杂。相应地要求集成电路封装密度越来越大，引线数越来越多，而体积越来越小，重量越来越轻，更新换代越来越快，封装结构的合理性和科学性将直接影响集成电路的质量。因此，对于集成电路的制造者和使用者，系统的认识和了解当下主流的集成电路封装技术，就显得非常的必要。 关键词：IC封装；集成电路；封装技术 Integrated circuit packaging development Abstract: Integrated circuit packaging is a process which use membrane technology and fine processing technology to layout, paste and fixed, and connects the IC and other components on the lead frame or PCB board to draw forth terminal and form whole solid construction using infusion fixed method with plasticity insulating medium. It is not only very important to set up and fixing and sealing and protecting chip and to enhance the performance of electric heating property, but also important to achieve connecting between inner chip and external circuit which using conductor to draw forth terminal from the output point of the inner chip to form the terminal of package shell. Then use those terminals and the circuit on PCB board to connect other components. Integrated circuit packaging was gone along with the development of integrated circuit. During the continuous development of integrated circuit and package technology, the whole set also become smaller and smaller, and the same time the function become more and more powerful. So require integrated circuit to become more and more intensive and complex to catch it. Correspondingly require integrated circuit packaging to become more and more intensive and the number of terminal become more and more, the size and the weight become smaller and smaller, the updating of technology become faster and faster. The reasonability and scientificity of package structure will affect directly the quality of integrated circuit. Therefore it is very necessary to systematically study an