Adhesive and adhesiveless contact mechanics of elastic layers on slightly wavy rigid substrates.pdfVIP

Adhesive and adhesiveless contact mechanics of elastic layers on slightly wavy rigid substrates.pdf

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International Journal of Solids and Structures 88–89 (2016) 101–109 Contents lists available at ScienceDirect International Journal of Solids and Structures journal homepage: /locate/ijsolstr Adhesive and adhesiveless contact mechanics of elastic layers on slightly wavy rigid substrates N. Menga a, L. Afferrante a,?, G. Carbone a,b a Department of Mechanics, Mathematics and Management, Politecnico di Bari, Viale Japigia, 182, 70126 Bari, Italy b Physics Department “M. Merlin”, CNR - Institute for Photonics and Nanotechnologies U.O.S. Bari, via Amendola 173, Bari I-70126, Italy article info Article history: Received 27 November 2015 Revised 4 March 2016 Available online 25 March 2016 Keywords: Contact mechanics Adhesion Pressure sensitive adhesives Coatings abstract The behavior of an elastic layer in contact with a wavy rigid substrate is analyzed depending on layer thickness, substrate geometry, energy of adhesion, for given value of remote applied load or penetration. Two different slab con?gurations are considered: (i) a free layer with uniform pressure acting on the upper boundary, and (ii) a con?ned layer with uniform displacement assigned to the upper boundary. These two different geometries have been considered as exemplar cases which are of great relevance in a large number of applications of crucial importance as structural adhesives, pressure sensitive adhesives, coatings and protective adhesives. Our study shows that the layer thickness affects the contact behavior differently depending on the constraints con?guration. In particular, reducing the thickness of the layer makes the latter more or less compliant depending on the considered con?guration. Thus, the free layer becomes more sticky and, as the layer thickness is reduced, an increasingly large amount of external work needs to be provided to detach the layer from the substrate. On the contrary, the con?ned layer signi?cantly stiffens by decreasing the layer thickness. This leads to an increase of th

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