半导体封装测试生产线瓶颈检测的一种方法.pdfVIP

第38卷 第1期 电 子 器 件 Vol．38　 No．1 2015年2 月 ChineseJournal of Electron Devices Feb. 2015 A Method of Bottleneck Detection of Semiconductor Assembly and Test Production Line∗ 1,2,3 3,4∗ 4,5 3,4 ZHANG Guohui ,LIU Chang ,YAOLili ,SHI Haibo (1．ChineseAcademy of Sciences RD CenterforInternet of Things,WuxiJiangsu 214135,China;2．JiangsuResearch and Development Centerfor Internet of Things,WuxiJiangsu 214135,China;3．Wuxi CAS Ubiquitous Information Technology RD Center CO.,LTD.,WuxiJiangsu 214135 China;4．Shenyang Institute of Automation,ChineseAcademy of Sciences,Shenyang 1100161,China; 5．University of ChineseAcademy of Sciences,Beijing 100049,China) Abstract:Bottleneck exists in all semiconductor production system. In order to improve the production capacity of the entire production system,we only improve the production capacity of the bottleneck. In the past,the method of bottleneckdetectionistoosingle,toapply difficultlytomorecomplex semiconductorproductionsystem.Theproduc- tion modelof semiconductorassembly andtestproductionsystemissetupbasedonthepreviousresearches.Itover- comes the disadvantagesof thepreviousmethodandcomesto amethodof bottleneckdetectionof semiconductor as- sembly and test production line. It demonstrates the effectiveness and robustness of the method by some examples. Key words:semiconductor assembly and testing;bottlenecks in production;bottleneck detection;identify indicators - EEACC:0170J　 　 　 　 doi:10.3969/j.issn.1005 9490.2015.01.010 半导体封装测试生产线瓶颈检测的一种方法∗ 1,2,3 3,4∗ 4,5 3,4 张国辉 ,刘　 昶 ,姚丽丽 ,史海波 (1． 中国科学院物联网研究发展中心,江苏