基于共晶二元Sn基焊料封装的Bi2Te3基热电堆.pdfVIP

（3 ）光电信息材料与器件 基于共晶二元Sn 基焊料封装的Bi Te 基热电堆 2 3 沈丽，徐广臣，赵然，郭福1 （北京工业大学材料科学与工程学院，北京 100124 ） 摘 要：热电元件焊接常用的焊料为铟基焊料和铋基焊料。由于碲化铋材料与低熔点合金焊料之间的浸润 性较差，常在碲化铋基热电元件上添加镍镀层。本文在大气条件下，不加助焊剂，采用共晶 SnBi 和 SnIn 焊料分别对n 型热电元件进行了铺展实验及界面显微组织的观察。铺展温度主要选择了2 10 ℃和300 ℃， 实验表明300 ℃界面结合比250 ℃更好。此外，热电元件表面通过蒸镀仪蒸镀上薄镍层。对含薄镍层热电 元件与不含镍层的热电元件的铺展实验进行对比，得到薄镍镀层可能会增加界面裂纹。 关键词：封装，热电堆，Bi (Te Se ) ，Sn 基焊料 2 0.9 0.1 3 Interfacial reaction between eutectic Sn-based solders and n-type bismuth telluride-based thermoelectric materials SHEN Li, XU Guangchen, ZHAO Ran, GUO Fu ( College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124) Abstract：The indium-based solders and bismuth-based solders are commonly employed in soldering the thermopile. Since the wettability between bismuth telluride materials and low melting point alloy solders is poor, a nickel layer was employed on the surface of thermoelectric materials. In this study, in the atmospheric environment, the eutectic Sn -Bi and Sn -In solders spreaded on the n-type thermoelectric respectively without using soldering flux, the corresponding interfacial microstructures were indentified. The interfacial reaction is more sufficient under 300 ℃ when comp aring to that under 250 ℃. In addition, a thin nickel lay er was dep osited on the thermoelectric unit by vapor deposition facility. However, a thin Ni-plated layer on thermoelectric materials might induce severe formation of cracks. Key words ：packaging, thermopile, Bi (Te Se ) , Sn-Bi/Sn -In solders 2 0.9 0.1 3 0 引言 热电材料是一种可以将机械能和电能进行直接转换的新型功能材料。随着热电材料的发 展，热电材料的应