英飞特电源布线规则.pdfVIP

英飞特电子(杭州)有限公司 Inventronics (Hangzhou) Co., Ltd. 文件类别 Guideline for 文件编号 版本 页次 指引文件 PCB design and check YFT-WI-RD-19 A 1 OF 23 1． Purpose 文件定义了我公司的开关电源产品的 PCB 设计的基本规则及设计流程，以确保 PCB 板在制做与装配过 程中的可行性，从而保证整个产品的质量及可靠性。 (In order to assures quality and reliability of our products. This document defines the design guidelines and the design flow of a Printed Circuit Board in our Power products for manufacture feasibility in both the fabrication process and the assembly processes. ) 2 ． Scope 适用于英飞特的所有电源产品。 (This document applies to all power products.) 3． Layout rules for printed circuit boards 3.1 General Rules 3.1.1 元件放置原则 ( Component layout rules) 3.1.1.1 适当的确定元件的摆放方向，对称元件尽量摆放在 X 轴，Y 轴方向，特别是小的贴片元件 （如0603，0805 ）过波峰焊方向最好与 PCB 板的长边垂直。请参见图 1。 (Orient components properly. Symmetrical components should be in X or Y orientations. And wave orientation of small chip component(such as 0603,0805) would be the best vertical to the longer side of PCB panel. See Figure #1.) 波峰焊方向/ Wave orientation 3.1.1.2 确保磁性原件,热调节器与 V-CUT 边的间距最小为 1mm ，建议 2mm. (The minimum distance between magnetism component body， thermistor to V-CUT edge is 1mm, suggest 2mm.) 3.1.1.3 一般贴片元件与 V-CUT 边的最小距离为 1.5mm, 陶瓷电容与V-CUT 边的间距最小为 2mm. (The minimum distance between SMD components and V-CUT edge is 1.5mm. The minimum distance between ceramic capacitor and V-CUT edge is 2mm.) 3.1.1.4 为确保生产插件顺利，相邻两插件元件间应保持最小 1mm 的间距。 (The minimum distance between the two adjacent DIP component is 1mm for the smooth production.) 3.1.1.5 为避免在过波峰焊时，贴片元件间发生连锡现象，0603 封装间距保持 min. 0.63mm, 0805 间保