High Temperature Stackchip, Dieattach （高温Stackchip Dieattach）.pdfVIP

High Temperature Stack-chip, Die-attach Adhesive Developments Currently solving many problems, but a new generation is needed. By Kevin Chung, Ph.D. [AI Technology, Inc.] he majority of die-attach adhesives2,3 , the use of epoxy film applications for chip adhesive with a coefficient of thermal Tpackaging are done with expansion (CTE) in the range of 40- o singulated dice and dispensed die- 60ppm/ C, modulus of more than 10 attach adhesive paste. Film adhesives million PSI, and the bond-line thickness have also been used for at least 10 of 10-20μm have produced parts of Figure 3a. Lamination Figure 3b. Dicing years for stack-chip applications. adequate reliability for at least the of wafer onto dicing die- wafer with DDAF In recent years, the use of film die- DRAM packages. attach film (DDAF) attach adhesives in wafer-level In this paper, we will examine the packaging has been in high-volume use criteria for wafer-level die attach with for DRAM applications with great higher efficiency, more reliability and success. In this type of thin wafer-level higher performance. packaging where the resulting device We will also examine the effects of Figure 3c. Shining UV Figure 3d. Pickup dice size and thickness are critical to interconnection from chip to package to release dice from DDAF commercial success, die-attach film has on the choice of die-attach solutions. been steadily reduced to 10μm or less The packaging, using w