BGA 封装结构热黏弹塑性的双尺度分析 - Journal of Northeastern.PDF

第31卷第11期 东 北 大 学 学 报 ( 自 然 科 学 版 ) Vol31, No. 11 2010 年 11 月 Journal of Northeastern U niversity( Natural cience) Nov . 2 0 1 0 BGA 李英梅, 刘 军, 刘 均 ( , 110004) : BGA ( ) , , Anand , Rayleigh-Ritz , , , , , : BGA; ; ; ; : O 343. 6; T N 602 : A : 1005-3026( 2010) 11- 1669-04 Double-Scale Analysis of Thermal Elastic-Viscoplasticity of BGA Packaging LI Ying-mei, LI U Jun, LI UJun ( chool of ciences, Northeastern University, henyang 110004, China. Correspondent: LI Ying-mei, E-mail: bird x01 @ sina. com) - Abstract: The BGA packaging of flip-chip assembly w ith underfill w as simplified into a multilayer board w ith imperfect periodical microstructure. Based on the homogenization theory w ith the Anand s unified viscoplastic constitutive model applied to the solder, a double-scale method w as proposed to analyze the thermal elastic-viscoplasticity of this improper periodical microstructure. T hen, the high-order discrete model w as introduced layer by layer via the Rayleigh-Ritz method to analytically solve the problem of BGA under thermal cyclic loads microscopically and mesoscopically, thus determining the thermal stress and strain. The analytic method w as verified simple and effective in comparison w ith FEM results. The result of a numerical example show ed that the thermal load and thickness of glue underfill are the main influencing factors on the responses of thermal elastic-viscoplasticity of BGA in soldering. Key ords: BGA( ball grid array) ; homogenization theory; elastic-viscoplasticity ; thermal cyclic load; multilayer board , ( ball grid array, BGA) , [5] ,