半导体绑定详细介绍.pptxVIP

WIRE BOND PROCESS INTRODUCTION CONTENTS ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理 M/C Introduction Wire Bond Process Material SPEC Calculator DEFECT 封裝簡介 晶片Die 金線 Gold Wire 導線架 Lead fram Wafer Grinding Die Bonding Wafer Saw toaster Wire Bonding Die Surface Coating Molding Laser Mark Solder Ball Placement Singulation Packing 封裝流程 Dejunk TRIM Solder Plating Solder Plating Dejunk TRIM TRIM/ FORMING BGA SURFACE MOUNTPKG THROUGH HOLE PKG Wire Bond 原理 pad lead Gold wire Ball Bond ( 1st Bond ) Wedge Bond ( 2nd Bond ) Al B.PRINCIPLE 銲接條件 HARD WELDING Pressure (Force) Amplify Frequecy Welding Time (Bond Time) Welding Tempature (Heater) THERMAL BONING Thermal Compressure Ultrasonic Energy (Power) Bond Head ASSY Low impact force Real time Bonding Force monitoring High resolution z-axis position with 2.5 micron per step resolution Fast contact detection Suppressed Force vibration Fast Force response Fast response voice coil wire clamp X Y Table Linear 3 phase AC Servo motor High power AC Current Amplifier DSP based control platform High X-Y positioning accuracy of +/- 1 mm Resolution of 0.2 mm W/H ASSY changeover · Fully programmable indexer tracks · Motorized window clamp with soft close feature · Output indexer with leadframe jam protection feature Tool less conversion window clamps and top plate enables fast device Eagle Bonding System Bonding Method Thermosonic (TS) BQM Mode Constant Current, Voltage, Power and Normal (Programmable) Loop Type Normal, Low, Square J XY Resolution 0.2 um Z Resolution (capillary travelling motion)2.5 um Fine Pitch Capability 35 mm pitch @ 0.6 mil wire No. of Bonding Wires up to 1000 Program Storage 1000 programs on Hard Disk Multimode Transducer System Programmable profile, control and vibration modes MACHINE SPECIFICATIONS (I) Eagle Vision System Pattern Recognition Time 70 ms / point Pattern Recognition Accu