线路板流程术语中英文对照.docxVIP

线路板流程术语中英文对照

流程简介：开料－－钻孔－－干膜制程－－压合－－减铜－－电镀－－塞孔－－防焊(绿漆/绿油)

?????????－－镀金－－喷锡－－成型－－开短路测试－－终检－－雷射钻孔

A.开料(CutLamination)

a-1裁板(SheetsCutting)

a-2原物料发料(Panel)(ShearmaterialtoSize)

B.钻孔(Drilling)

b-1内钻(InnerLayerDrilling)

b-2一次孔(OuterLayerDrilling)

b-3二次孔(2ndDrilling)

b-4雷射钻孔(LaserDrilling)(LaserAblation)

b-5盲(埋)孔钻孔(BlindBuriedHoleDrilling)

C.干膜制程(PhotoProcess(D/F))

c-1前处理(Pretreatment)

c-2压膜(DryFilmLamination)

c-3曝光(Exposure)

c-4显影(Developing)

c-5蚀铜(Etching)

c-6去膜(Stripping)

c-7初检(Touch-up)

c-8化学前处理,化学研磨(ChemicalMilling)

c-9选择性浸金压膜(SelectiveGoldDryFilmLamination)

c-10显影(Developing)

c-11去膜(Stripping)

Developing,EtchingStripping(DES)

D.压合Lamination

d-1黑化(BlackOxideTreatment)

d-2微蚀(Microetching)

d-3铆钉组合(eyelet)

d-4叠板(Layup)

d-5压合(Lamination)

d-6后处理(PostTreatment)

d-7黑氧化(BlackOxideRemoval)

d-8铣靶(spotface)

d-9去溢胶(resinflushremoval)

E.减铜(CopperReduction)

e-1薄化铜(CopperReduction)

F.电镀(HorizontalElectrolyticPlating)

f-1水平电镀(HorizontalElectro-Plating)(PanelPlating)

f-2锡铅电镀(Tin-LeadPlating)(PatternPlating)

f-3低于1mil(Lessthan1milThickness)

f-4高于1mil(Morethan1milThickness)

f-5砂带研磨(BeltSanding)

f-6剥锡铅(Tin-LeadStripping)

f-7微切片(Microsection)

G.塞孔(PlugHole)

g-1印刷(InkPrint)

g-2预烤(Precure)

g-3外表刷磨(Scrub)

g-4后烘烤(Postcure)

H.防焊(绿漆/绿油):(SolderMask)

h-1C面印刷(PrintingTopSide)

h-2S面印刷(PrintingBottomSide)

h-3静电喷涂(SprayCoating)

h-4前处理(Pretreatment)

h-5预烤(Precure)

h-6曝光(Exposure)

h-7显影(Develop)

h-8后烘烤(Postcure)

h-9UV烘烤(UVCure)

h-10文字印刷(PrintingofLegend)

h-11喷砂(Pumice)(WetBlasting)

h-12印可剥离防焊(PeelableSolderMask)

I.镀金Goldplating

i-1金手指镀镍金(GoldFinger)

i-2电镀软金(SoftNi/AuPlating)

i-3浸镍金(ImmersionNi/Au)(ElectrolessNi/Au)

J.喷锡(HotAirSolderLeveling)

j-1水平喷锡(HorizontalHotAirSolderLeveling)

j-2垂直喷锡(VerticalHotAirSolderLeveling)

j-3超级焊锡(SuperSolde