PCBA可制造性设计规范.pptVIP

下载本文档

62
0
约1.87万字
约 58页
2021-12-05 发布于湖北
举报
版权申诉

PCBA可制造性设计规范.ppt

1、有哪些信誉好的足球投注网站（book118）网站文档一经付费（服务费），不意味着购买了该文档的版权，仅供个人/单位学习、研究之用，不得用于商业用途，未经授权，严禁复制、发行、汇编、翻译或者网络传播等，侵权必究。。
2、本站所有内容均由合作方或网友上传，本站不对文档的完整性、权威性及其观点立场正确性做任何保证或承诺！文档内容仅供研究参考，付费前请自行鉴别。如您付费，意味着您自己接受本站规则且自行承担风险，本站不退款、不进行额外附加服务；查看《如何避免下载的几个坑》。如果您已付费下载过本站文档，您可以点击这里二次下载。
3、如文档侵犯商业秘密、侵犯著作权、侵犯人身权等，请点击“版权申诉”（推荐），也可以打举报电话：400-050-0827(电话支持时间：9:00-18:30)。
4、该文档为VIP文档，如果想要下载，成为VIP会员后，下载免费。
5、成为VIP后，下载本文档将扣除1次下载权益。下载后，不支持退款、换文档。如有疑问请联系我们。
6、成为VIP后，您将拥有八大权益，权益包括：VIP文档下载权益、阅读免打扰、文档格式转换、高级专利检索、专属身份标志、高级客服、多端互通、版权登记。
7、VIP文档为合作方或网友上传，每下载1次，网站将根据用户上传文档的质量评分、类型等，对文档贡献者给予高额补贴、流量扶持。如果你也想贡献VIP文档。上传文档

* * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * Pitch, b Body Size Pad Size Placement Size (mm) (mil) L1 W1 a c d L2 W2 0.5 19.685 　 12 A+30 W1+40 L1+30 d+30 0.6350.650 25.0025.59 14 A+30 W1+40 L1+30 d+30 0.65 25.59 B+4 A+30 W1+40 L1+30 d+30 Note * If the component pitch be defined by the metric unit , In English units should be considered for the calculation of the cumulative error of Pitch *The distance between connectors should at least have 2mm space from the outline edge of the Pad or Body. *For component higher than 5mm, need to keep same distance/clearance on pcb surface free from component to avoid shadow effect and causing AOI limiation. *The distance between smd type connector and chip should at least have 2mm space from the outline edge of the Pad or Body. (7)Connector pin for two side unit: mil SMT component PAD design (8)IC types a. SSOP, SOP Type Pitch, b Body Size Pad Size Placement Size (mm) (mil) L1 W1 a c d W2 L2 SSOP 0.4 15.748 　 8 60 W1+30 d+30 L1+20 SSOP 0.5 19.685 12 SSOP 0.635 25 14 SSOP 0.65 25.59 SSOP 0.8 31.496 16 SOP 1.27 50 25 　 Note * If the component pitch be defined by the metric unit , In English units should be considered for the calculation of the cumulative error of Pitch unit: mil SMT component PAD design (8)IC types b.QFP Pitch Body Size Pad Size Placement Size b W1 L1 a c d1 d2 W2 L2 19.485 (0.5mm) ? 12 60 W1+40 L1+40 d1+20 d2+20 25.59 (0.65mm) 16 90 W1+50 L1+50 d1+20 d2+20 31.496 (0.8mm) 18 90 W1+50 L1+50 d1+20 d2+20 Note If the component pitch be defined by the metric unit , In English units should be considered for the calculation of the cumulative error of Pitch unit: mil SMT component PAD design IC types (9)QFN Pitch Body Size Pad Size Placement Size b D E a c d1 d2 L2 W2 19.485(0.5mm) 　 12 60 E+40(On both sides of the 20 ) D+40(On both sides of the 20 ) d1+30 d2+30 25.59(0.65mm) 14 60 E+40(On both sides of the 20 ) D+40(On both si