焊点imc对3d ic封装可靠度的影响研究word格式论文.docxVIP

摘 要随着消费类电子产品日趋轻型、小型化，覆晶封装、芯片堆叠等 3D IC 封装 以其电性能好及封装体积小等优势成为业界发展趋势。3D IC 封装在使用中仍存在 可靠度问题，因测试实验耗时久，本文利用有限单元方法验证其可靠度，主要针 对 3D IC 芯片堆叠结构中存在的覆晶封装与 IMC 焊点两类结构，分别探讨其在循 环温度负载下的力学行为。首先针对覆晶封装结构，探讨锡球外形如锡球高度、 锡球接触角等参数对覆晶封装结构的可靠度影响。锡球接触角变小可提高锡球可 靠度，而锡球高度降低会减少锡球寿命，两者影响同时存在。底胶对于覆晶封装 结构而言是不可缺少的。进而探究 3D IC 芯片堆叠结构中存在的 Cu/Sn、Cu/Ni/In 两种不同 IMC 焊点，对封装体结构破坏模式的影响。以 In 层作为压力缓冲层来代 替 Cu/Sn IMC 结构做芯片堆叠的接合材料，可使芯片所受的最大应力下降而有效 保护硅芯片。关键词：覆晶封装3D IC 封装锡球可靠度IMC 焊点破坏模式AbstractWith consumer electronics products are becoming more lightweight and miniaturization, 3D IC packaging, such as flip-chip package and chip stacking, becomes the developing trend of electronic package industry, having advantages of excellent electrical properties and a small volume package, etc. 3D IC package still exists reliability issues in use. Due to test experimental time-consuming, this article uses the finite element method to verify its reliability. This paper is focused on two types of structure in the 3D IC chip stack package, including flip chip package and IMC solder joints structure, and investigates the mechanical behavior under cyclic temperature load, respectively. First, in flip chip package, to explore the reliability effect of solder ball shape parameters, such as solder ball height, contact angle, etc. The smaller Solder ball contact angle can improve the reliability of solder balls, while solder ball height reduction will reduce the life of the solder ball, and both above effects exist. Underfill is indispensable for flip chip package. Further, in 3D IC chip stack structure, to inquiry the impact of two different IMC joints, both Cu/Sn and Cu/Ni/In, on the failure mode of package structure. Indium-layer is used for the bonding material as a stress buffer layer, instead of the Cu/Sn IMC structure, so that decrease the maximum stress of silicon die and can protect the silicon chip effectively.Keywords：Flip chip package 3D IC package Solder ball reliability IMC jointsFailure mode目 录第一章绪 论 ..............