半导体光刻工艺技术.docVIP

毕业设计（论文）报告 题 目 半导体光刻工艺技术 系 别 尚德光伏学院 专 业 液晶显示技术与应用 班 级 0801 学生姓名 学 号 指导教师 2011年 4 月 半导体光刻工艺技术 摘要：在平面晶体管和集成电路生产中，要进行多次的光刻，以实现选择性扩散和金属膜布线的目的。光刻工艺是利用光刻胶的感光性和耐蚀性，在SIO2或金属膜上复印并刻蚀出与掩模版完全对应的几何图形.由于光刻工艺是一种非常精细的表面加工技术,在平面器件和集成电路生产中得到广泛应用.如果把硅片的外延、氧化、扩散和淀积看成是器件结构的纵向控制的话,那么，器件的横向控制就几乎全部有光刻来实现.因此,光刻的精度和质量将直接影响器件的性能指标,同时也是影响器件的成品率和可靠性的重要因素. 目前生产上通常采用的紫外光接触暴光法光刻工艺的一般过程;列出几种常用的光刻腐蚀剂配方;最后对光刻工艺中较常见的质量问题进行分析和讨论. Semiconductor lithography technology Abstract：In the planar transistor and integrated circuit production, to be repeated lithography, in order to achieve selective proliferation and metal film wiring purposes. Photoresist lithography process is the use of photosensitive and corrosion resistance, in the SIO2 or etching a metal film copies and corresponding exactly with the mask geometry. As lithography is a very fine surface processing technology, In the production of planar devices and integrated circuits are widely used. If the silicon epitaxy, oxidation, diffusion and deposition as the vertical structure of the control device, then the lateral control device and almost all had a lithography to achieve. Therefore, the accuracy and quality of lithography will directly affect the device performance, but also affect device yield and reliability of the important factors. Commonly used on current production of UV exposure lithography exposure the general process of law; lists several common lithography corrosive formula; Finally, the lithography process in the quality of the more common problems are analyzed and discussed.  Key Words: Lithography、Technology、Photoresist、Quality problems目录 前言……………………………….…………………………………………..……….1 第1章 光刻工艺简介………….…………...………………………………………...2 1.1 光刻工艺的定义……………..……………………………….………...……...2 1.2 光刻工艺剖析………………..……………………………….……….......…...2 1.2.1 表面准备……………..………….……………………….………...…...2 1.2.2 涂光刻胶……………..…….…………………………….………...….2 1.2.3 软烘培……………..…………….……………………….……….