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V I S H A Y S I L I C O N I X Power MOSFETs Application Note AN821 ® PowerPAK SO-8 Mounting and Thermal Considerations by Wharton McDaniel PowerPAK SO-8 SINGLE MOUNTING MOSFETs for switching applications are now available with The PowerPAK single is simple to use. The pin arrangement die on resistances around 1 m and with the capability to (drain, source, gate pins) and the pin dimensions are the handle 85 A. While these die capabilities represent a major same as standard SO-8 devices (see figure 2). Therefore, the advance over what was available just a few years ago, it is PowerPAK connection pads match directly to those of the important for power MOSFET packaging technology to keep SO-8. The only difference is the extended drain connection pace. It should be obvious that degradation of a high area. To take immediate advantage of the PowerPAK SO-8 performance die by the package is undesirable. PowerPAK single devices, they can be mounted to existing SO-8 land is a new package technology that addresses these issues. patterns. In this application note, PowerPAK’s construction is described. Following this mounting information is presented including land patterns and soldering profiles for maximum reliability. Finally, thermal and electrical performance is discussed. THE PowerPAK PACKAGE The PowerPAK package was developed around the SO-8 package (figure 1). The PowerPAK SO-8 utilizes the same footprint and the same pin-outs as the standard SO-8. This Standar