Soldering, Brazing, Die and Wire Bonding to （焊接、钎焊、死亡和线结合）.pdfVIP

Soldering, Brazing, Die and Wire Bonding to Electroless Nickel; Conditions that Influence Reliability By Don Baudrand Consultant for MacDermid, Inc. Waterbury CT April 1995 847 , Soldering, Brazing, Die and Wire Bonding to Electroless Nickel; Conditions that Influence Reliability By Don Baudrand htroducti on Reliablejoining to electroless nickel deposits is critically important to the electronic industry as well as in hardware fabrication. Because electronic devices oflen are subjected to extreme temperature excursions during fabrication? electroless nickel deposits may change physical characteristics in bulk and on the surface wherejoining takes place. High temperatures are common for multi-chip modules (MCM-C) and hybrid circuits on ceramic substrates. Nickel is a good electrical conductor compared with thick films used to metallize ceramic substrates. Therefore, it is used to enhance conductivity as well as corrosion resistance? diffusion barrier and the ability to be soldered, brazed, wire and die bonded. The conditions for eachjoining method must be correct for the type of electroless nickel deposit. Adjustments may be necessary to compensate for the environment to which the deposit is exposed in he fabrication process. Electroless nickel deposits have excellent unif