T2紫铜箔材的U型弯曲变形.pdfVIP

18 12 Vol. 18 No. 12 2010 12 Opt ics and Precision Engineering Dec. 2010 1004- 24X( 2010) 12-2610-06 T2 U 王春举, 郭 斌, 单德彬 ( 哈尔滨工业大学 材料科学与工程学院, 黑龙江 哈尔滨 150001) : U , , , U , , , ; , , ; , , , ; , : 紫铜箔材; 微成形; U 型弯曲; 尺寸效应; 回弹 :T G306 : A doi : 10. 3788/ OPE. 2610 U- bending process of T2 copper foil WANG Chun-ju, GU O Bin, SHAN De- bin (School of Material Science and Engineering, H arbinInstitute of Technology , H arbin 150001, China) Abstract: A U-bending test w as designed by using a micro female mold w ith different groove w idths and corner radii on a micro extension tester made by SANS company. T he effects of the mold dimen- sion and foil thickness on the maximum punch load, springback and surface quality w ere analyzed dur- ing the micro U-bending process. The results indicate that the reductions of groove w idth or radius leads to the increases of maximum punch load and the rates of increasing or decreasing of punch load increase greatly. By comparison of the punch loads of foils w ith different thicknesses, it is show n that the decreasing rate of punch load is larger than that of cross section area, and the size effect occurs ob- viously. Furthermore, the springback angle increases w ith the decreasing of thickness or radius, w hich reduces the accuracy of microparts. As the scratch appears at the side surface of a micro bending part, it suggests that the surface quality of the mold should be improved and the lubricating should be taken. T he results have an important significance on the design of foil microforming process. Key words: copper foil; microforming; U-bending; size effect; springback : 2010-03-05; : 2010-05-28. : ( No. ; ( No. 200 046088 ) ; ( No. 2008RFQXG04 1) ;