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Development of thicker negative tone resist.pdf

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Development of thicker negative tone resist

1JSR Confidential 1 Materials Innovation JSR Corporation DEVICE INTEGRATION MATERIALS Dept. Electronic Materials Div. Akito Hiro May, 7h , 2014 Development of thicker negative tone resist for bumping applications Symposium on Polymers 1 1. Introduction JSR Packaging Materials for 2D and 3D application 2. Thick photo resist for plating: ELPAC THB-series ELPAC THB-series line-up THB-series design concept and features 3. Development of photo resists for bumping or pillar Design of thick resists for bumping or pillar New grade litho and plating performance 4. Summary Contents TM TM TM ? ? Symposium on Polymers 2 2000 2005 20103D-WLP 2.5D（Si interposer）2.1D（Organic interposer） Photo-Sensitive Insulator : WPR WL-CSP Photo-Sensitive Insulator : WPR PR for Micro bump: THB (FT=20-30um, ~6um-C/H) PR for Solder : THB PR for Rewiring : THB FT=8um, 2um-L/S PR for Cu pillar: THB (FT=50um,~20um-C/H) JSR Packaging Materials for 2D and 3D application TM TM TM TM TM TM Symposium on Polymers 3 Rewiring Bumping 110N series for RDL (FT=8um, 2um-L/S) 150N series for C4/Cu bump grade (FT=50um,20um-C/H) 120N series for Micro bump (FT=20-30um, 6um-C/H) JSR ELPAC THB series High resolution, Wide process margin, Durability to plating solution , Easy strip Radical Negative tone resist Feature TM ELPAC THB-series line-up TM ? Symposium on Polymers ? 4 Features of THB series for 2D/3D application 1.Good pattern on any metals. 4. Compatible with any Plating solutions 2. Applicable thicker FT Plating solution Cu, Ni, Au, Sn-Ag, etc. Cu, Au, Si, etc. 100um 100um THB TM (Radical Negative resist) (Good developability) substrate 3. For via Application THB TM THB TM THB-series design concept and features Symposium on Polymers TM TM 5 For via application (Good developability for via) UVUV Coat and Prebake Exposure UV Plating After development SubstrateSubstrate 25um 50um 20umφ 10umφ Developing in via is excellent. THB TM THB-series design concept and features Symposium on Polym