Highdensityleadframe.docVIP

Share Semiconductor packaging for consumer applications ruled by dueling cost, complexity drivers January 12, 2011 -- Popular consumer products such as smartphones, tablet PCs, and LED televisions have created demand for a new breed of low-cost advanced packaging technologies. There are a few key attributes in the highest demand for devices targeting these applications: a reduced footprint and/or profile, high electrical performance, fine-pitch design, custom features, and a low cost. As consumer applications evolve into smaller, feature-rich devices, the supply chain must respond to meet these low-footprint, high-density component packaging demands. Over the last several years, the quad flat package no leads QFN package has been the standard device due to the benefits it offers small, light, better thermal, etc. . Devices are getting smaller and are proving to be a challenge to assemble with finer pitches and longer bond wires. The introduction of dual-row QFNs has helped to reduce the package size and improved manufacturability. But these multi-row QFNs present their own challenges including finding manufacturers that can produce good lead features and ensuring the capability of an SMT house to mount multi-row QFN with no lead standoff height. In some cases, they also affect singulation by requiring a dual-pass process. Newer technologies have taken the dual-row QFN a step further. The etched leadless package ELP offers flexibility with up to 3 rows with isolated pads, power and ground rings. This gives the device manufacturer options to optimize product performance. The triple-row capability provides an even smaller footprint having more I/Os. Another advantage of this package over standard QFNs is that the sawing process only cuts the mold compound, improving the cutting speed by 2× and extending saw blade life of the saw blade. Figure 1. Variations of the etched leadless package ELP . Another newer multi-row QFN-style package is QPL’s HDL technology. U