纳米无铅焊料的研究进展_杨明.pdfVIP

电子工艺技术 年 月 第 卷第 期 Electronics Process Technology 1 2014 1 35 1 ·综述· 纳米无铅焊料的研究进展 1 1 2 1 杨明 ，韩蓓蓓，马鑫，李明雨 （1.哈尔滨工业大学深圳研究生院先进材料深圳重点实验室，广东 深圳 518055； 2.深圳市亿铖达工业有限公司，广东 深圳 518101） 摘　要：电子封装互连过程中，无铅锡基焊料是常用的连接材料。然而，由于其较高的熔点（210～ 240 ℃），在电子器件连接过程中需施加较高的回流温度，这不仅增加了电子组装过程中的能耗，也大大降低 了器件的可靠性。纳米无铅焊料具有热力学尺寸效应，其熔点较块体材料有大幅度的降低，从而受到了越来越 广泛的关注。综述了近年来国内外纳米无铅焊料的发展动态，介绍了常用的纳米无铅焊料的制备方法及影响纳 米颗粒尺寸的因素，总结了纳米无铅焊料在应用和存放过程中所产生的问题，同时也对纳米无铅焊料未来产业 化的实现提出了建议。 关键词：纳米无铅焊料；微电子组装；焊接 中国分类号：TN604　文献标识码：Ａ　文章编号：1001-3474（2014）01-0001-06 Current Status of Nanolead-Free Solder Alloys 1 1 2 1 YANG Ming , HAN Bei-bei , MA Xin , LI Ming-yu ( 1. Shenzhen Key Laboratory of Advanced Materials, Shenzhen Graduate School, Harbin Institute of Technology, Shenzhen 518055, China; 2. Yik Shing Tat Industrial Co. Ltd., Shenzhen 518101, China ) Abstract: Lead-free solder alloys are widely used in electronic packaging. However, due to the limitation of their high melting point (210～240 ℃), a great temperature must be applied during soldering. The increased working temperature not only increases the energy consumption but also threatens the joint reliability. Nano lead-free solder alloys are being attracted more and more attentions because the melting point of an alloy in nano size is much lower than that in normal size due to the thermodynamic size effect. Review the recent domestic and international developments of the nano lead-free solder alloys, introduce their preparation methods and infl uencing factors, summarize the problem during their application and storage, and fi nally, propose some advice in their ind