电子封装用陶瓷基片材料的研究进展.pdfVIP

·16 · 材料导报 　 　2008 年 11 月第 22 卷第 11 期 电子封装用陶瓷基片材料的研究进展 张兆生 ,卢振亚 ,陈志武 (华南理工大学材料学院 ,广州 5 10640) 摘要 　　简要介绍了电子封装发展情况及其对基片材料的性能要求 ,分析了陶瓷基片作为封装材料性能上的优 点 ,概述了几种常用陶瓷基片材料的优缺点及其应用 :Al O 作为传统的陶瓷基片材料 ,优点是成熟的工艺和低廉的 2 3 价格 ,但热导率不高 ;BeO 、BN 、SiC 等都具有高热导率 ,在某些封装场合是合适的选择 ;AlN 综合性能最好 ,是最有希 望的电子封装陶瓷基片材料 。介绍了多层陶瓷基片材料的共烧技术和流延成型技术 ,并指出L TCC 技术和水基流延 将是未来发展的重点 。 关键词 　　电子封装 　陶瓷基片 　共烧 　流延 Research Progress in Cera mic Substrate Material f or Electronic Packaging Z HAN G Zhao sheng , L U Zhenya , C H EN Zhiwu (College of Mat erial s Science and Engineering , Sout h China U niver sit y of Technolo gy , Guangzhou 5 10640) Abstract 　　The develop ment of elect ronic p ackaging and it s element al requirement for elect ronic p ackaging sub st rat e mat erial s are briefly reviewed in t hi s p ap er . The advant ages of ceramic sub st rat e mat erial are analyzed . The ad vant ages , di sadvant ages and app lication of some common ceramic sub st rat es are summarized :mat ure p rocess and co st effectiveness are t he two advant ages of Al O ceramic a s t raditional ceramic sub st rat e ,but t he t hermal conductivit y i s 2 3 not high enough ; t he t hermal conductivities of BeO ,BN , SiC are high ,and t hey are suit able choice to be u sed in some p ackaging field ; AlN has t he best comp rehen sive p rop erties and it i s t he mo st p romi sing elect ronic p ackaging ceramic mat erial . Cofiring and t ap eca sting t echnology in fabricating multilayer ceramic sub st rat es are di scu sse