EQ new format (Opulent).xls

Sheet3 Sheet2 Sheet1 No. 1.4.1 1.4.2 1.5.1.2 1.5.1.3 1.5.2.2 1.5.3.2 3.1.2 3.1.3 3.1.4 3.3.2 +/-0.2mm Checking all files provided by customer Gerber files of all layers are enough and valid: No Sample board from customer Sample board is accordant with gerber files All fabrication information from customer is enough,valid and exclusive 1.5.1 Laminate 1.5.1.1 Laminate type, board thickness, copper thk is required Layer structure is required (for multi layer) 1.5.2 1.5.2.1 Type and color is required 1.5.3 Legends (silkscreen) 1.5.3.1 Not require Halogen free 3.1.1 3.2.1 3.3.1 4.8.1 +/-0.15mm +/-0.08mm +/-0.13mm +/-10% mm +/-0.1mm +/-10% ohms +/- 5 deg R 0.4mm (min) Files match each other All layers figure in drawing match figure in gerber Holes quantity,size,attribute,location in drawing match in gerber files All outline dimensions in drawing match in gerber Gerber data is reasonable and normal Inner outer circuit layers No open or short circuit No isolated circuit pads in inner layer All letter are in the correct side, no need to be reversed; Made in USA) No abnormal markings (i.e useless logo, date code; Solder mask layers All plated holes have been opened solder mask opening; No unwanted s/m opening; No s/m opening missing No copper exposed due to solder mask opening Legends (Silkscreen) No legend will be on circuit pad, in hole or out of board Minimum via hole size is ( )mm, within capability No need to add tear drops at via hole location Annular ring is enough for holes; Spacing between hole pads is ( )mil,within capability No need to add dummy circuit pads at rails or in unit Spacing between copper outline is enough Hole to outline (rout or punch): ( )mil min Hole to V-cut center line: ( )mil min Copper to outline (rout or punch): ( )mil min Copper to V-cut center line: ( )mil min Copper to outline (Bevel area): ( )mil min Width height of letters, numbers is within capability Spacing between hole outline is