霉菌对裸铜与镀金处理的印制电路板腐蚀行为的影响.pdfVIP

霉菌对裸铜和镀金处理的印制电路板腐蚀行为的影响 1) 1,2) 1,2) 1) 1,2) 邹士文 李晓刚 董超芳 李慧艳 肖葵 1) 北京科技大学腐蚀与防护中心，北京 100083 2)腐蚀与防护教育部重点实验室，北京 100083 摘 要：采用扫描Kelvin 探针测试技术研究了裸铜印制电路板(PCB-Cu)和无电镀镍金处理印制电路 板(PCB-ENIG)在霉菌作用下的腐蚀行为，通过体视学显微镜、扫描电镜结合能谱分析对PCB 的腐蚀 和霉菌生长情况进行了观察和分析。结果表明，在湿热环境下霉菌在两种材料表面均能良好生长并 且数量逐渐增加，28 d 完成一个生长代谢周期且分生孢子活性良好；84 d 后试样表面都出现了腐蚀 产物，PCB-ENIG 腐蚀更为严重。霉菌的生长代谢作用在一定程度上能抑制PCB-Cu 表面霉菌生长区 域的腐蚀，但是对PCB-ENIG 的微孔腐蚀起促进作用。 关键词：霉菌，印制电路板，扫描Kelvin 探针，铜，镀金处理 中图法分类号：TG174.4 文献标识码：A Effect of mold on corrosion behavior of printed circuit board—copper and enig finished Zou shiwen1) li xiaogang1,2) dong chaofang1,2) li Huiyan1) XIAO Kui1,2) 1) Corrosion and Protection Center, University of Science and Technology Beijing, Beijing 100083 2) Key Laboratory of Corrosion and Protection, Ministry of Education, Beijing 100083 ABSTRACT ：With the development of miniaturization of electronic circuits and occurrence of growing number of project failure cases, the corrosion behavior of printed circuit board (PCB) becomes a non-ignorable scientific issue under the hygrothermal condition with mold. In this paper, the corrosion behavior of unfinished PCB (PCB-Cu) and PCB finished by electroless nickel immersion gold (PCB-ENIG) in mold environment was studied using scanning Kelvin probe (SKP). The mold growth behavior was observed by stereo microscope and SEM, and the corrosion products were analyzed by EDS. The results showed that an increased number of mold could be seen on the surface of PCB-Cu and PCB-ENIG specimens under hygrothermal condition. After a growth cycle of 28 d, the new generation of conidium formed with good activity. After 84 d mold test, corrosion occurred on both two kinds of specimens and it was more severe on PCB-ENIG. Meanwhile the activity of mold w