重庆2025自考[大功率半导体科学]英语二高频题考点.docxVIP

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重庆2025自考[大功率半导体科学]英语（二）高频题(考点)

一、选择题（每题2分，共20题）

1.WhichofthefollowingisNOTamajormaterialusedinhigh-powersemiconductordevices?

A.Siliconcarbide(SiC)

B.Galliumnitride(GaN)

C.Indiumphosphide(InP)

D.Silicon(Si)

2.Inthecontextofhigh-powersemiconductordevices,whatdoesthetermthermalconductivityreferto?

A.Theabilityofamaterialtoconductelectricity.

B.Theabilityofamaterialtodissipateheat.

C.Theresistancetocurrentflow.

D.Thefrequencyofoscillation.

3.WhatistheprimaryadvantageofGaN-baseddevicesoverSi-baseddevicesinhigh-powerapplications?

A.Lowercost.

B.Higherbreakdownvoltage.

C.Loweroperatingtemperature.

D.Betterradiationresistance.

4.Whichofthefollowingisakeychallengeinfabricatinghigh-powersemiconductordevicesinChongqing?

A.Lackofskilledlabor.

B.Limitedsemiconductormanufacturinginfrastructure.

C.Highenergycosts.

D.Abundantrawmaterialresources.

5.WhatdoestheacronymSiCstandforinthecontextofsemiconductormaterials?

A.SiliconCarbonide.

B.SiliconCompound.

C.SiliconCrystal.

D.SiliconCarbon.

6.Whichofthefollowingisacommonissueinhigh-powersemiconductordevicesduetohighcurrentdensity?

A.Reducedlifespan.

B.Increasedefficiency.

C.Lowerpowerloss.

D.Improvedthermalstability.

7.Whatistheprimaryfunctionofaheatsinkinhigh-powersemiconductordevices?

A.Toincreasecurrentflow.

B.Toreducevoltagedrop.

C.Todissipateexcessheat.

D.Toenhancedeviceswitchingspeed.

8.Whichofthefollowingmaterialsisknownforitshighthermalconductivityandisoftenusedinhigh-powersemiconductorpackages?

A.Aluminumoxide(Al?O?).

B.Diamond.

C.Silicondioxide(SiO?).

D.Tungstencarbide(WC).

9.Whatisthetermforthevoltageatwhichasemiconductordevicebreaksdownandallowscurrenttoflow?

A.Cut-offvoltage.

B.Breakdownvoltage.

C.Operatingvoltage.

D.Saturationvoltage.

10.Whichof