DB43_T 2371-2022 传感器用陶瓷基片通用技术条件.docxVIP

ICS?29.035.30 CCS?K?15  43 湖 南 省 地 方 标 准 DB43/T?2371—2022 传感器用陶瓷基片通用技术条件 General?technical?specification?of?ceramic?substrates?for?sensors 2022?-?07?-?08?发布 2022?-?10?-?08?实施 湖南省市场监督管理局 发?布 DB43/T?2371—2022 目 次 前言························································································································?Ⅲ 1 范围?·····················································································································?1 2 规范性引用文件?······································································································1 3 术语和定义?············································································································1 4 结构形式?···············································································································2 5 技术要求?···············································································································2 6 试验方法?···············································································································3 7 检验规则?···············································································································4 8 标志包装和运输贮存?································································································?5 I DB43/T?2371—2022 传感器用陶瓷基片通用技术条件 1??范围 本文件规定了传感器用陶瓷基片的结构形式、技术要求、试验方法、检验规则、标志包装和运输贮 存。 本文件适用于以氧化铝制备的压力（外力）感应的电容式传感器用陶瓷基片。 2??规范性引用文件 下列文件中的内容通过文中的规范性引用而构成本文件必不可少的条款。其中，注日期的引用文件， 仅该日期对应的版本适用于本文件；不注日期的引用文件，其必威体育精装版版本（包括所有的修改单）适用于本 文件。 GB/T?2828.1 计数抽样检验程序 第?1?部分：按接收质量限（AQL）检索的逐批检验抽样计划 GB/T?5593—2015 电子元器件结构陶瓷材料 GB/T?5594.2—1985 电子元器件结构陶瓷材料性能测试方法 杨氏弹性模量、泊松比测试方法 GB/T?5594.3—2015 电子元器件结构陶瓷材料性能测试方法 第?3?部分：平均线膨胀系数测试 方法 GB/T?5594.4—2015 电子元器件结构陶瓷材料性能测试方法 第?4?部分：介电常数和介质损耗角 正切值的测试方法 GB/T?5594.5 电子元器件结构陶瓷材料性能测试方法??体积电阻率测试方法 GB/T?5594.7 电子元器件结构陶瓷材料性能测试方法 第?7?部分 透液性测定方法 GB/T?6062 产品几何技术规范（GPS）?表面结构 轮廓法 接触（触针）式仪器的标称特性 GB/T?6569—2006 精细陶瓷弯曲强度试验方法 GB/T?7665—2005 传感器通用术语 GB/T?14619—2013 厚膜集成电路用氧化铝陶瓷基片 GB/T?20737—2006 无损检测通用术语