简易型led粘片机开发与研究-机械电子工程专业论文.docxVIP

AbstractAccording Abstract According to stIlding on tlle process of印oxyn dropping and chip placing in LED packaging，the thesis mes to deVelop a simple LED die bonder． The mesis has stlldied and discussed the designs of motion mechanjsm，contrDlling techniques，location methods that based on pattem recognition，motion coⅡtrolling algorithrn，motion sequence，etc．Some design methods and con廿ol algorithms of it haVe廿1e certain academic and practical Value． This simple LED die bonder is made up of nve mechanisms and two contr01 module s- FiVe mechanisms are as follows：印oxyn dropping mechanism，die bonding mechanism， 1ead疗锄e transfcr mechanism，chip feeding table and illumination adjusting setting．I、Ⅳo control modules are motion contml rnodule aIld pat七em recognition module． The nlain research in this thesis are as f0Uows： 1)Mechanism des噜n：the jobs of comparison，a11alysis and choosing have been done to some important mechanism in mis thesis．Panicularly on the epoxyll dropping mecllanism a11d lea曲aIIle transfer mechanjsm，whjch have been given detailed design work．111e“ve methods ofthose t、vo mechanism are base on me stepping motor，cam mechanism and some other auxiliary mechanisms，which has the characteristics of simple，low cost and印propriate prccision．What’s more，ttle detailed design and checking pmcess ofc锄are also provided by this thesis． 2)Motion con仃01 module des细：A motion control system base on mdus田PC，I／0 board，motion con仃ol board，stepping driver and stepping motor has been established in this thesis，wllich is in cha唱e of the management and haIldling of di丘brem input aild output signals，coIl仃ollillg and coordinating aU mechanisms to finish t11e set motion mode and t11e precise displacement州th the assistance of detecting sensor． 3)Pattem recognition module design：“’s made up of image c印turing board，CCD and optics parts．T11rou曲employing the optimal algoritllIIl base on pyr锄idal stmcture search and sequemial similarity detection algorithm(SSDA—_reference to pamler Luoding’s