DSC对苯基苯酚改性酚醛树脂固化机理研究_张衍.pdfVIP

固体 火 箭 技 术 第 30卷第 2期 Journal ofSolid RocketTechnology Vo.l 30No. 2 2007 DSC① 张 衍, 刘育建, 王井岗, 韩哲文 (华东理工大学材料科学与工 学院超细材料制备与应用教育部重点实验室, 上海 200237) : 采用 SC技术、K issinger法对苯基苯酚改性酚醛树脂的固化过程进行了研究,得到放热峰顶活化 为 169. 3 kJ/ mol,远大于普通酚醛树脂(约 70 kJ/mol) 。理论近似凝胶温度、固化温度及后处理温度分别为 414. 5 K、448. 9 K 和 483. 9 K。酚醛树脂的固化通常由化学反应控制和扩散控制两阶段组成。通过 O zawa法得到活化 与转化率 (E-a )的变化关系 表明, 2种树脂固化历程存在明显差异。普通酚醛树脂固化反应进行到 10% ( a = 10% ), 粘度迅速增大, 反应转向扩散控 制; 而苯基苯酚改性酚醛树脂固化反应时粘度变化小, 直至 a = 70%, 才较快增长。这将有利于小分子的逃逸和各基团充 分反应。同时高活化 也表明, 反应形成了高键 的化学键, 有利于提高树脂的残炭率和烧蚀性 。 : 差示扫描量热法; 苯基苯酚;酚醛树脂; 固化 : TQ323. 1 : A : 1006-2793( 2007) 02-0142-04 Investigation on curing mechanism of phenylphenolmodified pheno-l formaldehyde resin by means of DSC method ZHANG Yan, LIU Yu-jian, WANG Jing-gang, HAN Zhe-wen (Key Laboratory forU ltrafineM aterials ofM inistry of Education, School ofM aterials Science and Engineering, EastChina University of Science and Technology, Shanghai 200237) Abstract: The curing process of phenyl-phenolmodified pheno-l formaldehyde resin was investigated bymeans of SC andK is- singermethods. The results show that its apparent activation energy at exotherm ic peak is 169. 3 kJ/mo,l which ismuch higher than that of common pheno-l formaldehyde resin( about 70 kJ/mol). The theoretic approxmi ate temperatures of ge,l cure and post-treat- ment formodified pheno-l formaldehyde resin are 414. 5 K, 448. 9 K and483. 9K respectively. The curing process of pheno-l forma-l dehyde resin consists of two stages, i. e. chem ical reaction control and diffusion contro.l The relationship between activation energy (E ) and the c