自动化设备维修技术资料（Technical data of automatic equipment maintenance）.docVIP

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自动化设备维修技术资料（Technical data of automatic equipment maintenance）.doc

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自动化设备维修技术资料（Technical data of automatic equipment maintenance）

自动化设备维修技术资料（Technical data of automatic equipment maintenance） DOC documents may experience poor browsing on the WAP side. It is recommended that you first select TXT, or download the source file to the local view. Automation equipment maintenance technical data of 1. COMS complementary metal-oxide semiconductor (complementary metal oxide semiconductor), it is used in P channel and N channel transistors together, the main advantage of the circuit is low power consumption, good anti-jamming performance, and more than double pole transistor has the advantages of simple process, is a relatively high degree of integration the main components of the micro processor. 2. under the operating conditions, the room temperature is not less than 0 degrees centigrade, not higher than 50 degrees centigrade, and the maximum relative humidity is 95% at 25 degrees centigrade. 3., in the replacement or removal of printed circuit boards, remember to turn off the equipment power, the operator should release the human body electrostatic (such as the use of iron way) in order to operate. 4. integrated board is put into the bag after the removal of carbon for safekeeping to prevent agglomeration damage induced charge integrated components. 5. in the repair welding semiconductor resistor or a faulty pipe, welding temperature is not too high, not too long time, use electric iron general in 15 ~ 25W is good in welding work best while using vacuum pump to prevent the welding slag, slag splashing, causing a short circuit fault, new circuit etc.. 6. the forced cooling device shall check whether the contact of the radiator is good and whether the ventilation and cooling is normal. 7. check whether the independent earthing system of the electronic equipment is in good condition and check whether the fuse of the protective circuit is compatible with the component characteristics. 8., check the discrete components of lead, solder joints, circuit boards, conductive copper film corrosion?. Specific me