Solder Reflow Attach Method for High Power RF …（焊料回流连接方法高功率射频u2026）.pdfVIP

Freescale Semiconductor AN1908 Application Note Rev. 1, 2/2011 Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages By: Keith Nelson, Quan Li, Lu Li, and Mahesh Shah INTRODUCTION • Carrier ó Can either be pallet or coin. This metal piece forms part of the thermal and electrical connection. The The purpose of this application note is to provide Freescale carrier is attached to the PCB ground plane as well as to Semiconductor customers with a guideline for solder reflow source contact of the RF PA device. mounting of high power RF transistors and integrated circuits • Coin ó A carrier that is smaller than the PCB. in Air Cavity Packages (ACP). This document will aid customers in developing an assembly process suitable for • Flange ó The exposed metal at the bottom of the their design as well as their manufacturing operation. Each package. The die is attached to the top of the flange, and Power Amplifier (PA) design has its own unique performance the exposed bottom surface is designed for attaching to requirements. Similarly, each manufacturing operation also the carrier. has its own process capabilities. Therefore, each design and • Heatsink ó The carrier is typically bolted to a finned assembly may require some fine--tuning. The intent of this heatsink. The heatsink forms the part of the thermal