SMTAI 2007 SOLDER JOINT AND SOLDER FILLET （SMTAI 2007焊,焊角）.pdfVIP

SMTAI 2007 SOLDER JOINT AND SOLDER FILLET OPTIMIZATION FOR SURFACE MOUNTED TERMINAL BLOCKS Michel Hodak Dubravka Kusmic WECO Electrical Connectors Inc. MontrÈal, QuÈbec, Canada mhodak@weco.ca dkusmic@weco.ca ABSTRACT The appearance and strength of surface mount solder joints are the objects of concern and scrutiny in all OEM and Soldering technology has undergone recent changes CEM involved in these processes. Managements instigated by the European Unionís (EU) imposition of EU profitability and productivity concerns often impose directive: Restriction of Hazardous Substances in Electrical excessive and almost impossible demands upon line speeds and Electronic Equipment (RoHS) Directive 2002/95/EC. and set up times. These can have detrimental effects upon The RoHS directive stipulates that lead, mercury, cadmium, first-pass yields, proportion defectives, repair, and rework hexavalent chromium, polybrominated diphenyl ether and in the assembly process. The effect on customer satisfaction polybrominated biphenyls will be banned from new with regards to late orders, defective product and returned electrical and electronic equipment as of July 1st, 2006. By goods is even more important. It is, thus, important to have eliminating these substances from new equipment the RoHS a technique to optimize the circuit boards solder pad si