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Simulation and Modeling of Capacitive Coupling ...（仿真和建模的电容耦合u2026）.pdf

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Simulation and Modeling of Capacitive Coupling ...（仿真和建模的电容耦合u2026）

2012 4th International Conference on Computer Modeling and Simulation (ICCMS 2012) IPCSIT vol.22 (2012) © (2012) IACSIT Press, Singapore Simulation and Modeling of Capacitive Coupling Interconnection For 3D Integration 1 1 1 2 2 Kai-Jen Liu , Chun-Wei Huang , Yu-Jung Huang ,Ming-Kun Chen and Yi-Lung Lin 1Department of Electrical Engineering, I-Shou University, No.1, Sec. 1, Syuecheng Rd., Dashu Township, Kaohsiung, Taiwan 840 Taiwan, R.O.C. 2Advanced Semiconductor Engineering Test RD, 10 West 5th Street, Nantze Export Processing Zone, Kaohsiung, Taiwan 811, ROC yjhuang@.tw ,mkc_chen@ Abstract. This study presents the simulation and modelling of a capacitive coupling interconnection circuit for three-dimensional (3D) system integration. The potential benefits of 3D integration provide an alternative to scaling when it comes to cramming more functionality in a smaller space. It could also enable an increase in performance by shortening signal paths. The proximity data link is performed via capacitive couplings between the top facing dies for 3D system integration. In the study, based on 3D electromagnetic (EM) simulations of High Frequency Structure Simulator (HFSS) for the capacitive pad between two pads of dies have been simulated. The simulation results show that the effect of cross-coupling between adjacent channels is dependence on substrate characteristic and pads arrangement. In addition, the HSPICE simulation results show that the data