大功率led封装技术及其发展（High power LED packaging technology and its development）.docVIP

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大功率led封装技术及其发展（High power LED packaging technology and its development）.doc

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大功率led封装技术及其发展（High power LED packaging technology and its development）

大功率led封装技术及其发展（High power LED packaging technology and its development） Doc document may at the WAP end of the browsing experience poor. Suggest you select TXT, or download the source file to the machine view. High power LED packaging technology and its development First, the high-power LED package due to the structure and complex process, and directly affects the performance and lifetime of LED, has been a hot research topic in recent years, especially in high power white LED package is a hot research topic in the. The function of LED package includes: 1. mechanical protection, in order to improve the reliability; 2. to strengthen the heat, to reduce the chip junction temperature, improve the performance of LED; 3. optical control, improve light efficiency, optimize the beam distribution; 4. power supply management, including AC / DC conversion, and power control. LED packaging method, material, structure and process selection is mainly decided by the chip structure, photoelectric / mechanical properties, application and cost etc.. After 40 years of development, the LED package has experienced scaffolding (Lamp LED), patch type (SMD LED), LED (Power LED) power development. With the increase of chip power, especially the development of solid-state lighting technology demand, LED package of optical, thermal and electrical and mechanical structure and put forward a new and higher requirements. In order to effectively reduce the thermal resistance, improve the light efficiency, must adopt the technology of new ideas to packaging design. Two, the key technologies of high power high power LED package LED package mainly relates to light, heat and electricity, structure and process, as shown in figure 1. These factors are independent of each other, mutual influence. Among them, the light is led package, heat is the key, power, structure and technology is the means, and the performance is the embodiment of package level. The process compatibility and reduce the production c