一种新型MEMSVOA芯片的设计-电子科学技术.PDF

电 子 科 学 技 术 电 子 科 学 技 术 Electronic Science Technology 22 00 11 55 年年 第 0 2 卷 第 0 5 期 2 0 1 5 年 9月 Electronic Science Technology Vol.02 No.05 Sep.2015 一种新型MEMS VOA芯片的设计 侯继东，黄惠良 （上海鸿辉光通科技股份有限公司，上海嘉定，201822） 摘 要： 本文首先简介 了M EM S V OA 芯片 的研发历史总结了现有各种此类芯片 的特 点和缺 陷然后介绍了一种新型的MEM S V OA 芯片的设计思路和简要工艺流程对新型芯片的测量表 明衰减范围超过40 dB , 响应时间小于1m s 和现有主流芯片相 比新型芯片的工艺流程对于设备 要求低制造成本低响应时间快抗冲击性能高 关键词：MEM S V OA 芯片设计工艺流程制造成本 新型结构 中图分类号：TN 253 文献标识码：A 文章编号： 2095-8595 (2015) 05-514-06 电子科学技术 URL : http//www.chin a-est .com .cn DOI : 10 .16453/j .issn .2095-8595.20 15.05.00 1 Design of a New Type of Chips For MEMS VOA Jidong Hou, Huiliang Huang ( Shanghai Honghui Optics Communication Tech. Co., LTD., Shanghai, Jiading, 201822 , China ) Abstract: The RD history of MEMS chips applied in Telecom, especially the chips for VOA are reviewed, and the shortcoming of this kind of chips are summarized. A new type of chips for MEMS VOA, of which the design idea is pre-build-tilting- angle, is proposed. The fabrication process of the chips is introduced briefly. Packaged in device, the new type of chips shows the capability of more than 40dB attenuation range, with the response time of less then 1ms. Compared with the popular chips in the market, the new type of chips can be fabricated by standard equipment with high properties. Key words: MEMS VOA;Chip-design; Processing; Cost of Manufacture; New Type of Structure 引言