FCBGA封装器件的失效分析与对策-失效分析与预防.PDF

2007 11 N ovem ber, 2007 2 4 V o l. 2, N o. 4 FCBGA 1, 2 1 1 1 1 2 , , , , , ( 1. 电子元器件可靠性物理及其应用技术国家级重点实验室 信息产业部电子第五 究所, 广州 510610 2. 华南理工大学 物理科学与技术学院, 广州 510640) [ ] FCBGA ( F lip- ch ip ball grid array) , FCBGA , FCBGA , F CBGA , , , [ ] FCBGA [ ] U 262. 46 [ ] A [] 1673-62 14( 2007 ) 04-0055-04 Failure Analysis and P recau tion of FCBGA Packaged D evices 1, 2 1 1 1 L IN X iao- ling , KONG Xu e- dong , EN Y un - fe i, ZHANG X iao- w en , 1 2 PENG Z e- ya , YAO Ruo- he ( 1. China ElectronicProductReliability and Environmental Testing Research Institute, Guangzhou 510 610, China; 2. South China niversity of Technology, Physics science and technology, Guangzhou 510 64 0, China) A bstrac t: N ow adays, FCBGA ( F lip - ch ip b all gr id array ) is the optmi a l cho ice for IC s p ackag e. F ocu s shou ld be put on its re- liability. The stru cture ch aracter istic of FCBGA packaged dev ices and som e correlative re liab ility prob lem s o f them w ere intro- du ced in this p ap er. By tw o fa ilure ana lysis cases o f FCBGA dev ices, the author found the fa ilure m ech anism s o f the tw o fa iled dev ices. They are short o f the so lder b a lls and open of the so lder bum p s on the FC die, resp ective ly. T he cau se fo r sho rt is the so lder m e lted and m ade the nearby so lder ba lls linked. T he cau se for open is the epoxy un