ElectromigrationinLead-FreeSolderandItsAvoidance无铅焊料的.PDF

Open Journal of Nature Science 自然科学, 2013, 1, 1-5 /10.12677/ojns.2013.11001 Published Online May 2013 (/journal/ojns.html) * Electromigration in Lead-Free Solder and Its Avoidance 1,2 2 3 2# Jichao Jiang , Yumei Ling , Wenchao Yang , Yongzhong Zhan 1Qianan College, Hebei United University, Qianan 2College of Materials Science and Engineering, Guangxi University, Nanning 3Xingjian College of Science and Liberal Arts, Guangxi University, Nanning Email: #zyzmatres@ th th th Received: Apr. 7 , 2013; revised: Apr. 20 , 2013; accepted: Apr. 29 , 2013 Copyright © 2013 Jichao Jiang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Abstract: The development of miniaturization and multi-functionality of electronic products increases the current density in lead-free solder joints and promotes the failure caused by electromigration. This paper discusses the physical mechanism of lead-free solder electromigration failure and from the wiring geometry, thermal effect, grain size, dielectric film and other aspects of the electrical factors the impact of migration, introduces the electromigration damage, and then from the structure design, welding process and materials selection and other aspects of suppressing electromig