Application Note AN1016 International Rectifier（应用程序指出一个 1016国际整流器）.pdfVIP

Application Note AN-1016 Hermetic Surface-Mount Discrete Semiconductor, Solutions to Assembly Integration By Tiva Bussarakons Table of Contents Page Introduction …….2 New Surface Mount Package Construction …….3 TO-25x Package Construction …….4 D2 and D3 Packages …….4 Low Ohmic TO-257, TO-254, D2 and D3 …….5 Benefits of SMD over Leaded Packages …….6 Size and Weight Benefits …….6 Electrical Performance Benefits …….7 SMD Assembly Integration Design Guidelines …….9 Verification Methods for Attachment Integrity …….12 SMD Rework Procedure …….12 Conclusions …….12 This application note discusses the reliability and ruggedness issues of the ceramic leadless chip carrier (CLCC), SMD and TO-25x hermetically sealed packages for high reliability design applications. AN-1016 1 Introduction A hermetically sealed package is generally required to house a semiconductor device to insure the device’s reliability and ruggedness for high reliability design applications. Typical semiconductor devices are MOSFETs (metal-oxide-semiconductor-field-effect-transistors), bipolar transistors, Schottky rectifiers, PN junction diodes, and insulated gate bipolar transistors (IGBT). Hermetic surface mount packages, leadless chip carriers (also known as LCC or CLCC) have served this function well and have be