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电烙铁的温度(The temperature of the electric iron) The basic process of lead-free soldering assembly includes: A. lead-free PCB manufacturing process; 96.5Sn/3.5Ag and 95.5Sn/4.0Ag/0.5Cu eutectic and eutectic eutectic alloy systems for solder paste applications in b.; 99.3Sn/0.7Cu eutectic alloy system for wave soldering applications c.; D. alloy system for 99.3Sn/0.7Cu welding by hand. Although these are feasible, but the specific implementation still exist several problems, such as raw material cost is still higher than the standard Sn/Pb process, the moisture limit increased, required to maintain the state of air inert in the wave soldering process in (to have adequate nitrogen And may increase the reflow temperature to the limit temperature range (between 235~245 degrees C) and raise the thermal requirements for various components. As far as lead free alternatives are concerned, there is no universally accepted standard now. After many discussions with many professionals in this field, we come up with some of the following technical and application requirements: Metal prices, many assembly manufacturers require lead-free alloy price can not be higher than 63Sn/37Pb, but unfortunately, all existing lead-free alternatives cost more than 63Sn/37Pb above 35%. In the selection of lead-free solder wire and metal electrode, the cost is one of the most important factors in the production of solder paste; and, in the overall manufacturing cost due to relatively high proportion of the cost, so the price is not so sensitive to metal. Melting point Most assembly manufacturers (not all) require a minimum temperature of 150 DEG C to meet the operating temperature requirements of the electronic equipment. The maximum liquid phase temperature is determined by the specific application. Wave soldering electrode: in order to successfully implement wave soldering, liquid temperature should be low The furnace temperature is 260 degrees centigrade. Soldering wire for hand / machine welding
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