25mw太阳能设备配置（25MW solar device configuration）.docVIP

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25mw太阳能设备配置（25MW solar device configuration）.doc

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25mw太阳能设备配置（25MW solar device configuration） This article is contributed by bjl1288 DOC documents may experience poor browsing on the WAP side. It is recommended that you first select TXT, or download the source file to the local view. 25MW solar production line equipment configuration table In the energy shortage and environmental problems under the double pressure, the world has set off a boom of development and utilization of solar energy and renewable energy, solar energy is the inexhaustible renewable energy, and clean energy, in line with Chinas industrial policy to encourage. The 25MW solar production line equipment configuration is introduced as follows: first, production capacity of 156 * 156mm chip, each piece of power is about 2.5W, to work 16 hours a day yield is about 1800/ / h, so the annual output of 25MW. Two, the number of process equipment and configuration 1, all domestic procurement (10 million yuan) The production efficiency of the process system of cashmere wafer cleaning machine equipment list of 1800 pieces per hour for allocation of the number of manufacturers can handle 1. wafer size: 145 x Max156mm 156mm 2.3 mechanical arms, 11 tank 1. can handle wafer diameter: Max156mm * 156mm dry dryer 150 / min 245 rotation speed of 100 - 2. 3. 900min 0.003 m 4. nitrogen nitrogen filtering drying 1. thermal cavity size: suitable for 2 ~ 8 wafer 2. constant temperature accuracy: less than 0.5 DEG C diffusion furnace 500 / 348 hours (800 to 1280 DEG C) 3. temperature zone stability is + 0.5 DEG /24h (800 DEG to 1280 DEG C 4.) thickness uniformity (a group): 5% 000 Changsha etching etching machine 1120 / 2 hour gold limited to PSG technology to phosphorus silicon glass 1800 / 45 hours The 1. can handle silicon wafer size: Max156m * 156mm 2. reaction chamber limit vacuum: 1Pa 3., automatic adjustment vacuum pressure product technical index, describe single unit price (10000 yuan) Total (10000 yuan) 1. silicon chip size: Max156mm * 156mm 2.1 mechanical ar