集成芯片LED 场地照明灯新型叠片散热器热分析 - 安全与环境工程.PDFVIP

第35卷摇 第6期 发摇 光摇 学摇 报 Vol郾35 No郾6 2014年6月 CHINESEJOURNAL OF LUMINESCENCE June,2014 文章编号:1000鄄7032(2014)06鄄0742鄄06 集成芯片LED场地照明灯新型叠片散热器热分析 * 何摇 凡, 陈清华 ,刘娟芳,刘摇 娇,柴伟伟 (重庆大学 动力工程学院,重庆摇 400044) 摘要:针对大功率LED场地照明集成芯片散热问题,提出了一种新型散热器结构。 该散热器利用高导热纯 铝材料,采用叠片的方式成型。 采用实验和有限元模拟相结合的研究方法,对包括直流电源的新型叠片式 LED散热器的散热性能进行了研究。 结果表明:LED 电源达到稳态所需时间较长,最终能够稳定在一个较低 的温度范围。 叠片式纯铝散热器通过增加散热面积和提高散热器材料的导热系数能有效降低LED结温。 所 设计的散热器和选择的电源在自然对流条件下能够很好地满足250 W大功率LED散热要求。 关摇 键摇 词:大功率LED;散热器;热分析;有限元 + 中图分类号:TN312 .8 摇 摇 摇 文献标识码:A摇 摇 摇 DOI:10.3788/ fgx0742 Thermal Analysis of High Mast Integrated LED Lamp with New Heatsink Structure of Laminated Pure Aluminum Plate * HE Fan,CHEN Qing鄄hua ,LIUJuan鄄fang,LIUJiao,CHAI Wei鄄wei (College of Power Engineering,Chongqing University,Chongqing 400044,China) *Corresponding Author,E鄄mail:qhchen@ Abstract:A new heatsink structure of laminated high heat conductivity pure aluminum plate was proposed forthethermalmanagementof highpowerintegratedLEDforhighmastlighting. Aninves鄄 tigation of experiment andfinite element simulationwascarried out for the demonstration of the heat dissipation performance. The transient process of LED drive is longer and the steady state tempera鄄 ture iswithin the range of required operationtemperature. The LEDjunctiontemperature can be ef鄄 fectively decreased due to the increasing of the heat dissipation area. The experiment results show that thedesignedheatsinkandselectedLEDdrivecansatisfytheheatdissipationrequirementof250 W high power high mast lamp. Key words:high鄄power LED;heat sink;thermal analysis;FEM