在PCB板的设计傍边抗ESD的方法与剖析(国外英语资料).docVIP

在PCB板的设计当中抗ESD的方法与分析(国外英语资料) This article is contributed by zhangxiao9925 Pdf documents may experience poor browsing on the WAP side. It is recommended that you first select TXT, or download the source file to the local view. The method and analysis of anti ESD in the design of PCB board From human, environment and even electronic equipment for electrostatic semiconductor chip precision will cause various injuries, such as through the internal components of thin insulating layer; a gate MOSFET lesion and CMOS components in the CMOS device; trigger lock; short PN junction reverse biased p-n junction is short; the bias; melting active devices in welding wire or wire. In order to eliminate the interference and damage of electrostatic discharge (ESD) to electronic equipment, a variety of technical measures should be taken to prevent it. Which is the latest hot spots of information: LTC1421CG-2.5 DP83955AV TLC5921DAP ALP029 chip UCC3585M DS3633N MAX6003EUR-T RC5036M-T MAX326CSE TMS320LC542PGE2-40 In the design of the PCB board, the anti ESD design of PCB can be realized through layering, proper layout, routing and installation. In the design process, the majority of the design changes can be limited to components only through prediction. By adjusting the layout and wiring of PCB, ESD can be well protected. Here are some common precautions. * as far as possible, the use of multilayer PCB, relative to the double-sided PCB, the ground plane and power plane, and closely spaced signal line ground distance, can reduce the common mode impedance and inductive coupling, so that the double-sided PCB 1/10 to 1/100. Signal each signal layer as close as possible to a power or ground layer. For the top and bottom surfaces, there are components, PCB with very short links, and many filling sites, which can be considered using inner lines. * for double sided PCB, a tightly interleaved power and ground grid are used. The power cord is close to the ground wire and connects as much as poss