ADP129(负载开关).pdf

ADP1290 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. JA is specified for the worstcase conditions, that is, a device Parameter Rating VIN to GND 0.3 V to +16.5V soldered in a circuit board for surface-mount packages. VOUT to GND 0.3 V to V IN Table 3Thermal Resistance EN to GND 0.3 V to +16.5V Package Type JA JB Unit Continuous Drain Current 6-Ball, 0.5 mm Pitch WLCSP 260 58 °C/W T = 70°C ±3 A J T = 105°C ± 1.6A J Continuous Diode Current 50 mA ESD CAUTION Storage Temperature Range 65°C to +150°C Operating Junction Temperature Range 40°C to +105°C Soldering Conditions JEDEC J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.