高热导率低热膨胀系数Cu-ZrW2O8复合材料的制备与性能.pdfVIP

学兔兔 第l4卷第5期 粉末冶金材料科学与工程 2009年lO月 、，01．14 NO．5 Materials Science and Engineering of Powder Metallurgy Oct．2009 高热导 同7 寸 率低热膨胀系数Cu．ZrW2O8复合材料的制备与-I,土J4-~月匕B 彭卓玮，李劲风，．郑子樵 (中南大学 材料科学与工程学院，长沙 410083) 摘 要：以负热膨胀材料ZrW208与金属Cu为原料，分别采用常规烧结法和热压法制备具有高热导率低膨胀系数 的新型 Cu基复合材料Cu．ZrW208，研究ZrW208体积分数与烧结方法对该复合材料致密度、热导率及热膨胀系 数的影响。结果表明：热压法制备的Cu一50％ZrW2O8复合材料的热导率达173．3 W／(m·K)，致密度为91．6％，均明 显高于常规烧绐样品；热压样品的热膨胀系数为¨．2×10- K- ，稍高于常规烧结样品；在 150--300℃温度范国 内热处理后该样品的平均热膨胀系数降低到10．87×10 K- ，较纯Cu的平均热膨胀系数17×10-6K- 低很多，有 望成为一种新型的电子封装材料。 关键词：负热膨胀；Cu．ZrW20 复合材料；热压；热导率；热膨胀系数 中图分类号：TQ174 文献标识码：A 文章编号：1673．0224(2009)5．337．06 Preparation and properties of Cu-ZrW208 composites with high thermal conductivity and low thermal expansion coefficient PENG Zhuo-wei，LI Jin-feng，ZHENG Zi-qiao (School of Materials Science and Engineering，Central South University，Changsha 410083，China) Abstract：The Cu based composite with low thermal expansion rate and high thermal conductivity has been fabricated by conventional sintering and hot-press methods using ZrW208 and Cu as raw materials．The effect ofthe volume fraction of ZrW208 and sintering method on density，thermal conductivity and therm al expansion coefficient of the Cu—ZrW208 composites has been studied．The results show that the composite fabricated through hot—press has higher density than that of fabricated through conventional sintering．The Cu-50％ZrW20s(volume fraction)composite fabricated through hot-press has a therm