电子浆料用超微细玻璃粉的等离子体改性.pdfVIP

7 Vol.25 No.7 2006 7 Jul. 2006 ELECTRONIC COMPONENTS MATERIALS R D TG148 A 1001-2028 2006 07-0056-03 Plasma Surface Modification of Ultra-fine Glass Powder for Electronic Paste LUO Shi-yong, YANG Li-zhen, GE Yuan-jing, CHEN Qiang (Laboratory of Plasma Physics and Materials, Beijing Institute of Graphic Communication, Beijing 102600, China) Abstract: A thin silicon oxide encapsulation film was coated on the surface of ultra-fine phosphate glass particles for electronic paste by high frequency plasma polymerization of hexamethyldisiloxanc. The influence of surface energy of glass particles from plasma treatment was characterized by the contact angle measurement of the powder particle pellet. The comparison of the fineness, viscosity and rheological property of between the electronic pastes prepared respectively by the plasma treated and untreated glass powders showed a significant difference. The dispersion of glass ultra-fine powder in the organic vehicle of ethyl cellulose terpineol solution are improved significantly. Also, the results show that the surface energy of glass ultra-fine powder can be modified controllablely by plasma polymerizing a thin encapsulation film of silicon oxide. Hence, the rheological property and the printability of the electrical paste on different substrates may be tailored by the plasma modification method. Key words: inorganic non-metallic materi