LDI Dry-Film.pdfVIP

Dry-Film Developments for LDI - Technology 9/3/2009 DUPONT CONFIDENTIAL Russell Crockett Circuit Packaging Materials. DuPont Electronic Technologies Advanced Manufacturing Techniques. Rotherham 4 August. 2009 2Laser Direct Imaging for Printed Circuit Manufacture. Why Use LDI to expose a dry film resist? Is it an Enabling Technology? ? Improve production capabilities 9/3/2009 DUPONT CONFIDENTIAL Does it Improve Yields? ? Reduce costs 3Laser Direct Imaging for Printed Circuit Manufacture. The 5 Steps to Create the Image. ?Surface Preparation. ?Resist Lamination. ?Resist Exposure.LDI step. 9/3/2009 DUPONT CONFIDENTIAL ?Resist Development. ?Circuit Creation. ? Etching. ? Plating. 4Laser Direct Imaging for Printed Circuit Manufacture. The main Users of LDI Equipment. ?Prototype Market - Enabling Technology. ? Speed to production. No phototool preparation. 9/3/2009 DUPONT CONFIDENTIAL ? Flexability. Single board production. ?HDI Market – Yield Improvement. ? Side to side, layer to layer registration. ? Large panel registration to micro vias. ? Reduced repeat fault ( dirt ) imaging for fine line. ? Better quality and lower total cost. 5LDI History Nikon Pentax DI-2000 Dai-Nihon Screen Orbotech DP-100Polyscan PDI-2000 9/3/2009 DUPONT CONFIDENTIAL UV Laser out put 360nm * 350 - 365nm 405nm * 400 - 415nm 1990 1995 2000 6LDI Technology 355nm vs. 405nm Laser Polygon Mirror DMD Laser Wave Length：355nm Wave Length：405nm Polygon Mirror System DMD (Digital Micro Mirror Devise) System 9/3/2009 DUPONT CONFIDENTIAL Panel Feed direction Panel Feed direction Scan direction Polygon Mirror 305nm Orbotech DMD. Digital Micro-mirror Devise 405nm Fuji Pentax (ORC) Hitachi 7Polygon Optical System source: ORBOTECH UV Laser PolygonBeam S litt AOM 9/3/2009 DUPONT CONFIDENTIAL Lens System p er Stage movement during imaging Panel 8DMD 405nm LDI system Exposure CAD data Optical system Light Lens ON DMD 9/3/2009 DUPONT CONFIDENTIAL Panel feed direction Direct