CSP(Chip Scale Package) Handling Guide Book.pdf

CSP(Chip Scale Package) Handling Guide Book Rev.1 (Nov.2003)Semiconductor Written by Test team . (Rev.1 . Nov.2003.) 1. Understanding of CSP Package Type 2. Hynix’s CSP Product line 3. General Advice for Chip Mounting 4. Tape Reel / Tray Packing Handling 1. Understanding of CSP Package Type 2. Hynix’s CSP Product line 3. General Advice for Chip Mounting 4. Tape Reel / Tray Packing Handling Contents Confidential Rev.1 (Nov.2003) ? Chip-Scale Package (CSP) is growing rapidly in memory application and becoming common for FBGA packaging ? Compare to TSOP, Chip-Scale Package (CSP) offers extremely good characteristics and is small form factor and light-weight ? Chip-Scale Package (CSP) itself is too thin and fragile, so special caution must be taken to handle the CSP. 1. Understanding of CSP Package Type Chip Mold D/A AdhesiveBT Resin Solder Ball Cu Trace Chip Elastomer EncapsulantSolder Ball ? BT-Resin Substrate Type ? Wire Bonding ? 30~400 I/O range ? 0.5-1.27 mm pitch ? 0.8-1.3mm thick. ? EMC Mold or Encap. process ? Polymide Tape+Elastomer Type ? Lead Bonding ? 46~300 I/O range ? 0.5, 0.75, 1.0 mm pitch ? 0.7-1.2mm thick. ? Encap. process FBGA Type uBGA Type Confidential Rev.1 (Nov.2003) 2. Hynix’s CSP Product line [unit:㎜] Product Size(w×l) DRAM Type 1G DDR2 11.9 × 20.9 512M DDR2 12 × 14 512M DDR MCP 11 × 20 256M DDR MCP 12 × 12 256M DDR 8 × 13 Chip 128M DDR 12 × 12 256M Sync Handy 8 × 13.5 128M Sync MCP 11 × 13 128M Sync Handy 8 × 8 Chip 32M PSRAM 7×8, 6×7 16M PSRAM 7×8, 6×7 SRAM 8M SRAM 6×8.5 4M SRAM 6×8 Confidential Rev.1 (Nov.2003) 3. General Advice for Chip Mounting. l i i i A. Major cause of PKG Die Crack 1) Miss loading of chip on Tray by handling 2) Chip shock by Improper use of Hard Picker 3) Pick Up Position Error by Chip-Mounter 4) Miss loading on Chip-Mounter from any jarring movement or mishandling B. Recommending Mounting Pick and Placer Use of Soft Rubber Pad (Vacuum sucker) Vacuum Pad Size has to be smaller than Chip size Picker Pi